drivers/thermal

Linux Thermal Management Subsystem

Home of the kernel's thermal management framework, which coordinates temperature monitoring, trip points, governors, and cooling actions like CPU throttling or fan control. Individual hardware-specific thermal drivers from Intel, AMD, and various ARM SoC vendors plug into this framework rather than this directory binding to any single chip.

not-a-driver conf=1.00 deploy=none replacement=none subsystem=thermal category=not-a-driver
100%

recommendation

This is not actually a single driver directory; it is the umbrella for the kernel's thermal management framework, which provides the shared infrastructure for temperature sensors, cooling devices, throttling policies, and the many per-vendor thermal drivers that live in subdirectories underneath it.

repository signals

158 files
55,079 source lines
1,196 commits, 5y
+28,823 / −14,692 lines added / removed, 5y
226 authors, 5y
monthly commits · 2021-04-21 → 2026-04-21 · 1,196 total · active in 61/61 months
2021 2022 2023 2024 2025 2026 2021-04: 17 commits · +300 −182 2021-05: 10 commits · +861 −270 2021-06: 15 commits · +737 −99 2021-07: 2 commits · +15 −3 2021-08: 10 commits · +908 −11 2021-09: 10 commits · +90 −33 2021-10: 11 commits · +199 −75 2021-11: 12 commits · +407 −106 2021-12: 3 commits · +78 −56 2022-01: 13 commits · +761 −55 2022-02: 5 commits · +13 −3 2022-03: 12 commits · +147 −90 2022-04: 11 commits · +476 −54 2022-05: 17 commits · +660 −55 2022-06: 14 commits · +50 −178 2022-07: 24 commits · +251 −202 2022-08: 54 commits · +963 −1,372 2022-09: 9 commits · +39 −58 2022-10: 47 commits · +604 −847 2022-11: 22 commits · +291 −124 2022-12: 14 commits · +395 −208 2023-01: 69 commits · +1,809 −1,875 2023-02: 18 commits · +1,670 −542 2023-03: 50 commits · +1,025 −598 2023-04: 16 commits · +235 −610 2023-05: 12 commits · +464 −113 2023-06: 22 commits · +171 −124 2023-07: 18 commits · +195 −138 2023-08: 39 commits · +920 −443 2023-09: 49 commits · +276 −226 2023-10: 34 commits · +676 −457 2023-11: 8 commits · +71 −24 2023-12: 40 commits · +796 −729 2024-01: 20 commits · +1,117 −159 2024-02: 28 commits · +580 −393 2024-03: 14 commits · +165 −123 2024-04: 60 commits · +1,127 −605 2024-05: 32 commits · +273 −193 2024-06: 22 commits · +519 −97 2024-07: 42 commits · +473 −513 2024-08: 39 commits · +1,173 −603 2024-09: 8 commits · +293 −58 2024-10: 52 commits · +1,361 −975 2024-11: 8 commits · +44 −50 2024-12: 11 commits · +101 −94 2025-01: 9 commits · +124 −77 2025-02: 18 commits · +351 −62 2025-03: 7 commits · +74 −79 2025-04: 10 commits · +311 −48 2025-05: 12 commits · +611 −55 2025-06: 11 commits · +367 −50 2025-07: 10 commits · +545 −111 2025-08: 14 commits · +892 −48 2025-09: 10 commits · +641 −41 2025-10: 4 commits · +410 −9 2025-11: 14 commits · +345 −35 2025-12: 8 commits · +111 −23 2026-01: 16 commits · +127 −102 2026-02: 6 commits · +101 −105 2026-03: 2 commits · +33 −6 2026-04: 1 commit · +1 −0

sources

No sources cited.

codex reasoning notes (technical)

Not a driver directory: top-level thermal subsystem containing framework code and multiple thermal/cooling drivers, not a single kernel-bound hardware driver.